541330 – Engineering Services
541715 – Research and Development in the Physical, Engineering, and Life Sciences
334511 – Search, Detection, Navigation, Guidance, Aeronautical, and Nautical System and Instrument Manufacturing
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Sensor Pressure Housing for AUV – designed an enclosure/pressure vessel to house a suite of sensors and onboard processors for use on an AUV in deepwater environments.
Thermal Solution for FPGAs and Imaging Sensors – part of the electronics solution of an imaging system for an unmanned submarine. Consisted of high powered imaging boards and FPGAs housed in a pressure vessel. Thermal management was a primary concern; designed a system to couple to the outside walls using thermal straps and heat pipes.
Underwater Optical Train Design – optical lens array consisting of 10 different lens elements and mirrors for subsea applications. Challenge was to provide a means to mechanically locate them precisely while isolating them from the outside environment.
Weld Profile for Telemetry Sensors – laser beam weld process used to create a sealed environment in titanium cans for an array of acoustic underwater telemetry sensors.
Shipboard Electronics Packaging – solutions for housing imaging processing equipment in a marine environment, with design considerations to account for shock, vibration, and corrosion.
Stress Analysis of Optronics Mast – verified mechanical design is suitable to account for external pressure, wave slap, and shock loading.
Thermal Analysis of Optics Housing – requirement to maintain concentricity of optical elements to within .002”. Needed to design a precisely machined assembly for mounting the elements while considering the different expansion/contraction rates over a large temperature swing.
Pressure Sensor Housing – use of a delicate ceramic thickfilm pressure sensor required a robust method of mounting to accommodate freeze/thaw cycles and protect the sensor.
Improved Potting Bond – developed a process for a blown ion plasma treatment to greatly improve the bond quality of potting sealing an electronics and sensor enclosure.
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